LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, enabling slimmer, denser, and cooler smartphone designs.
Again, it’s about shrinking chips, not shrinking phones. With smaller chips there is more space for other things like slightly larger batteries. Phone size is not dictated by chip size.
Again, it’s about shrinking chips, not shrinking phones. With smaller chips there is more space for other things like slightly larger batteries. Phone size is not dictated by chip size.